Computational Fluid Dynamics

Many important industrial applications involve multiphase and free surface flows as well as moving and interacting bodies. Such applications constitute a major challenge for the existing commercial flow solvers on the market and the simulation times are often prohibitive. At FCC, we develop our own CFD software, IPS IBOFlow, perfectly suited for such applications.


IPS IBOFlow (Immersed Boundary Octree Flow Solver) is an incompressible, segregated Navier-Stokes solver based on unique immersed boundary methods and a Cartesian octree grid that can be dynamically refined and coarsened. These methods facilitate the treatment of moving and interacting objects in fluid flows and simplify the meshing procedure since surface descriptions of the flow boundaries are the only requirement to run a simulation. The meshless techniques in IPS IBOFlow set a new standard for CFD solvers by avoiding the cumbersome generation of 3D volume meshes. The software also includes a very robust, novel volume of fluids (VoF) module and turbulence models such k-epsilon and DES. A very efficient implementation and utilization of GPUs for computationally expensive parts give IPS IBOFlow a superior performance. IPS IBOFlow is perfectly suited for complex industrial multiphase flow applications. The solver also offers the possibility to simulate multi-physics problems such as fluid-structure interaction, fluid-heat transfer and fluid flow coupling with electromagnetic effects. The user-friendly GUI is based on the same pre- and post-processing routines as the FCC industrial path planning software, IPS.

Simulation in IPS IBOFlow to study Cooling of Electronics.
Simulation in IPS IBOFlow to study cooling of electronics.

Application areas

IPS IBOFlow is used to simulate paint, sealing and other surface treatment processes in the automotive industry, paper forming and edge wicking in the paper and packaging industry, solder paste jetting and cooling of electronic components in the electronics industry, and much more.

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