Abstract
The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate- fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization.